The PCB assembly water cleaning process uses water as the cleaning medium. A small amount (generally 2% – 10%) of surfactants, corrosion inhibitors and other chemicals can be added to the water. PCB assembly cleaning is completed by cleaning with a variety of water sources and drying with pure water or deionized water.
So today, we will introduce you to the principle of PCB assembly water cleaning technology and its advantages and disadvantages.
The advantages of water cleaning are that it is non-toxic, does not harm the health of workers, is non-flammable, non-explosive, and has good safety.
Water cleaning has good cleaning effect on particulate matter, rosin flux, water-soluble contaminants and polar contaminants.
Water cleaning has good compatibility with component packaging materials and PCB materials. It will not swell or crack the rubber parts and coatings, keeping the markings and symbols on the surface of the parts clear and intact and will not be washed away.
Therefore, water cleaning is one of the main processes for non-ODS cleaning.
The disadvantage of water cleaning is that the investment of the whole equipment is large, and it is also necessary to invest in the water production equipment of pure water or deionized water. In addition, it is not suitable for non-airtight devices, such as adjustable potentiometers, inductors, switches, etc. Water vapor entering the device is not easy to discharge, and even damage the ring element.
Washing technology can be divided into pure water washing and water plus surfactant washing.
The typical PCB assembly process flow is as follows: water + surfactant → water → pure water → ultrapure water → hot air washing → rinsing → drying.
Under normal circumstances, an ultrasonic device is added in the cleaning stage, and an air knife (nozzle) device is added in addition to the ultrasonic device in the cleaning stage. The water temperature should be controlled at 60-70°C, and the water quality should be very high. This alternative technology is suitable for enterprises with high requirements for mass production and product reliability in SMT chip processing plants. For small batch cleaning, small cleaning equipment can be selected.
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Post time: Nov-09-2022