Step 1: Pre-Production Engineering and File Processing
Gerber file receiving and integrity verification
Design Rule Check (DRC) for manufacturability
Design For Manufacturability (DFM) review and optimization suggestion submission
Customer confirmation for design adjustments
Tooling data generation including panelization, drill program, and photomask data
Production work order creation and parameter locking
Raw material preparation and incoming inspection
Step 2: Inner Layer Fabrication
Copper clad laminate cutting according to panel size specification
Inner layer dry film lamination under controlled temperature and pressure
UV exposure with high-precision photomask alignment
Developing process to remove unexposed dry film
Etching process to remove unwanted copper foil
Dry film stripping after etching completion
100% Automated Optical Inspection (AOI) for inner layer circuits
Qualified inner layer panels transfer to lamination process
Step 3: Multilayer Lamination
Inner layer black oxide or brown oxide treatment for better bonding performance
Prepreg and core material stacking according to layer stack-up design
Hot press lamination under programmed temperature and pressure curve
Lamination post-processing including cooling and panel trimming
X-Ray inspection for layer to layer alignment accuracy
Drilling target hole creation for subsequent processes
Step 4: Drilling Process
CNC drilling for through holes, blind holes, and buried holes
Drill bit inspection and replacement according to hit count
Hole position accuracy inspection after drilling
Hole wall quality check under magnification
Deburring process to remove hole edge residue
Back drilling process for high-speed signal boards
Step 5: Hole Metallization and Copper Plating
Desmear process to remove resin residue from hole wall
Electroless copper plating to form initial conductive layer on hole wall
Copper thickness inspection after electroless plating
Panel electroplating to increase copper thickness on trace and hole wall
Copper thickness measurement for both surface and hole wall
Impedance coupon test for impedance controlled boards
Step 6: Outer Layer Fabrication
Outer layer dry film lamination
UV exposure with high-precision alignment
Developing process for unexposed dry film
Pattern plating for copper and tin on exposed pads and traces
Dry film stripping after pattern plating
Etching process to remove unwanted base copper
Tin stripping after etching completion
100% Automated Optical Inspection (AOI) for outer layer circuits
Step 7: Solder Mask and Silkscreen Process
Solder mask ink coating on board surface
UV exposure with solder mask photomask
Developing process to remove unwanted solder mask
Solder mask curing under controlled temperature
Silkscreen printing for component marking, polarity indication, and board information
Silkscreen ink curing
Solder mask and silkscreen quality inspection
Step 8: Surface Finish Process
Surface pretreatment including cleaning and micro-etching
Surface finish processing according to customer specification
Surface finish quality inspection including thickness measurement and appearance check
Solderability test for sample panels
Step 9: Final Testing and Finishing
100% electrical test including continuity, isolation, and impedance verification
Final visual inspection for appearance, dimension, and structure
V-scoring, routing, and tab separation for panelized boards
Cleaning process to remove flux and residue
Baking process for moisture control
Vacuum packaging with desiccant and ESD protection
Final quality audit before shipment
