With over 15 years of specialized expertise in electronic manufacturing, we deliver high-performance, full-turnkey PCBA assembly services designed for the most demanding industries. From precise PCB fabrication and strategic component sourcing to advanced assembly, rigorous testing, and final box build, we provide a seamless end-to-end production pipeline that ensures your hardware is market-ready and reliable.
Our facility integrates fully automated SMT production lines and advanced inspection technologies, adhering strictly to IPC-A-610 international standards. Holding ISO9001, IATF16949, and ISO13485 certifications, we serve global leaders in automotive electronics, medical devices, aerospace, telecommunications, and industrial control, transforming complex designs into high-quality electronic realities.
Detailed Parameters
| Min Component Size | 01005 package (0.4mm × 0.2mm) | Min Fine Pitch | 0.3mm lead spacing (QFP, SOP) |
|---|---|---|---|
| Placement Accuracy | ±0.025mm (Chip) / ±0.015mm (IC) | Max Board Size | 500mm × 1200mm |
| Board Thickness | 0.2mm to 6.0mm | Placement Speed | Up to 150,000 CPH per line |
| SMT Feeders | Up to 120 feeders per line | THT Hole Diameter | Minimum 0.3mm |
| Supported Packages | BGA, CSP, QFN, LGA, 01005, 0201 | Quality Standards | IPC-A-610, ISO9001, IATF16949 |
Key Advantages
Certified Quality
Strict adherence to IPC-A-610 and ISO13485/IATF16949 ensures aerospace and medical grade reliability.
Rapid Prototyping
Flexible assembly capabilities supporting prototype runs from as few as 5 pieces for fast iteration.
Full Turnkey Service
One-stop solution covering fabrication, sourcing, assembly, and box build to reduce supply chain risk.
Mixed Technology
Expertise in combining SMT and Through-Hole (THT) components for complex industrial circuitry.
Advanced Inspection
3D SPI, AOI, and X-Ray inspection ensure zero-defect solder joints and perfect BGA alignment.
Global Sourcing
Partnerships with 2000+ authorized distributors including TI, ST, and NXP for authentic components.
Product Gallery
Management Platforms
BOM Optimization
Cost reduction analysis and supply chain stability optimization for all bill of materials.
Lifecycle Support
Expert alternative recommendations for long lead time or obsolete electronic components.
Traceability Mgmt
Full component batch traceability to ensure quality accountability across the production lot.
Quality Control
Integrated SPI, AOI, and FCT testing platforms to verify 100% functional performance.
Inventory Control
Professional management of consigned components with real-time stock tracking.
Environmental Test
Controlled thermal cycle, humidity, and vibration testing for extreme environment reliability.
Investment Return Comparison
| Service Model | Traditional Outsourcing | Our Turnkey Solution |
|---|---|---|
| Supply Chain | Fragmented (Multiple Vendors) | Unified (Single Source) |
| Quality Risk | High (Inconsistent Standards) | Low (IPC/ISO Certified) |
| Lead Time | Long (Sourcing Delays) | Short (Optimized Sourcing) |
| Cost Overhead | High (Coordination Costs) | Low (Integrated Management) |
| Testing Depth | Basic Visual Inspection | Advanced 3D X-Ray/FCT |
Frequently Asked Questions
We support low-volume prototype assembly with a minimum order quantity of just 5 pieces, allowing for rapid design validation.
Yes, we support BGA, CSP, and fine-pitch components down to 0.3mm lead spacing with placement accuracy as tight as ±0.015mm for ICs.
We are fully certified with ISO9001, IATF16949 for automotive electronics, and ISO13485 for medical device manufacturing.
Yes, our sourcing team provides alternative component recommendations for obsolete or long lead-time parts to ensure production continuity.
We offer a comprehensive suite including 3D SPI, AOI, X-Ray, ICT, Flying Probe, and Functional Testing (FCT) with custom fixtures.
Yes, our turnkey services extend to final box build, including enclosure installation, wiring, labeling, and final system testing.
