Overview
X-Ray Testing is a non-destructive inspection technology for internal hidden structures and invisible solder joints that cannot be detected by optical inspection methods. It uses a high-resolution X-ray imaging system to penetrate the product and form internal structure images, to inspect the quality of hidden parts of multilayer PCBs and assembled boards with BGA, QFN and other package components. This process is the only reliable method to verify the interlayer connection quality of multilayer boards and the hidden solder joint quality of fine-pitch components, and is a mandatory inspection item for high-complexity PCB and PCBA products. All X-Ray testing operations strictly follow IPC-A-600, IPC-A-610 international standards.
Non-Destructive Inspection Principle
The X-ray emission device generates a controllable X-ray beam to penetrate the tested product
Different materials inside the product have different X-ray absorption rates, forming a contrast image on the receiving end
The high-resolution imaging system captures and processes the image, to clearly show the internal structure of the product
The intelligent algorithm analyzes the image to identify defects and deviations, without damaging the tested product
2D and 3D imaging modes are available, to adapt to different inspection requirements of complex structures
Bare Board Inspection Applications
Layer-to-layer alignment accuracy verification of multilayer PCBs
Plated through-hole wall integrity and copper thickness inspection
Blind and buried via filling quality and interlayer connection inspection
Inner layer trace integrity and defect inspection
Inner layer copper pouring structure and thermal relief design verification
Resin plug hole filling quality and void inspection
Inner layer foreign matter and delamination defect inspection
Assembled Board Inspection Applications
Solder joint quality inspection of BGA, QFN, LGA and other hidden solder joint packages
Solder void, cold solder, and solder bridging defect inspection of hidden solder joints
BGA ball mounting alignment and missing ball defect inspection
Internal wire bonding quality inspection of chip components
Through-hole component pin solder filling quality inspection
Foreign matter inside the package and component damage inspection
Solder joint quality inspection after shield cover installation
High-Precision Parameter Calibration
The X-ray equipment is calibrated with a standard test block before each shift of use
Imaging resolution and penetration capability are verified daily, to ensure inspection accuracy
Equipment parameters are adjusted according to the board thickness, material, and component type of the tested product
The defect judgment standard is set according to IPC international standards and customer requirements
Regular maintenance and precision calibration of the equipment are carried out by professional technicians, with complete calibration records archived
Defect Classification Disposal Rules
Defects identified by X-Ray inspection are classified by risk level: critical defect, major defect, minor defect
Critical defects related to electrical connection and product safety will trigger 100% full inspection of the entire batch
Major defects will trigger rework verification, with re-inspection after rework
Minor defects that do not affect product function will be recorded, with customer confirmation required before shipment
All defect inspection results and disposal measures are documented and archived, with full traceability for each product
