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PCB Stencil

PCB Stencil


Core Service Introduction

Our high-precision PCB Stencil service is specially designed to support the entire solder paste printing process in SMT assembly, serving as the critical link to ensure uniform paste deposition, consistent soldering quality, and high production yield for both prototype and mass production projects. We focus on delivering stencil solutions that meet or exceed IPC-A-610 workmanship standards, ensuring compatibility with all mainstream SMT printing equipment and adapting to diverse component layout requirements.


Core Manufacturing Processes

We offer two professional manufacturing processes to cater to different project needs:

Laser-cut stainless steel stencils: Adopting advanced laser cutting technology, we achieve micron-level aperture accuracy with a trapezoidal opening design that optimizes solder paste flow. This process is ideal for fine-pitch components such as 01005 micro-components, BGA, QFN, and QFP packages, providing deep width ratio and precise positioning to minimize bridging, dewetting, and solder ball defects.

Chemical-etched stainless steel stencils: Using high-precision chemical etching technology, we offer a cost-effective solution for standard PCB designs. This process supports flexible customization of aperture shapes and sizes, with smooth hole walls and consistent thickness, suitable for small-batch production and general electronic assembly projects.


Material Standards

All our stencils are made of premium 304 stainless steel as the standard material, with nano-coating available as an optional upgrade. The nano-coating significantly improves solder paste release performance, reduces residue adhesion, and extends the service life of the stencil, especially suitable for high-volume mass production scenarios requiring repeated printing.


Customization Options

We provide full customization to match your specific project requirements:

Size Options: Customizable stencil dimensions to fit all mainstream SMT printers, with both framed and frameless options available.

Aperture Design Optimization: Free DFM review service based on your Gerber files. Our engineering team will optimize aperture sizes and shapes according to component packages, PCB pad designs, and printing process parameters, helping you avoid printing defects caused by unreasonable design in advance.

Thickness Customization: Standard stencil thickness options include 0.1mm, 0.12mm, 0.15mm, and 0.2mm, with custom thickness available upon request to adapt to different solder paste types and printing volumes.


Supporting Services

Stencil production is coordinated with PCB fabrication and assembly orders. Automatic Gerber file processing is provided, along with free DFM review for stencil openings. Design flaws can be eliminated before production to streamline the entire PCBA workflow.


Quality Assurance

We implement a strict three-step quality inspection process for every stencil:

Dimensional Inspection: Using high-precision optical measuring equipment, we verify aperture size, position accuracy, hole wall smoothness, and overall stencil flatness, ensuring all parameters match the design files with a tolerance of ±0.01mm.

Performance Testing: Conduct printing tests on sample stencils to confirm solder paste release effect and printing uniformity, ensuring zero missing paste or uneven deposition.

Traceability Documentation: Provide complete production and inspection records for each stencil, including material batch, processing parameters, and inspection reports, supporting full lifecycle quality tracking.


Delivery Standards

For delivery, we offer fast turnaround times: 24-hour rush service for prototype orders and 3-5 working days for standard mass production orders, with reliable logistics to ensure safe delivery of finished products.


Typical Application Fields

Our PCB Stencil services are widely applied in various electronic manufacturing fields, including:

High-precision medical electronic devices

Automotive electronic components

5G communication equipment

Industrial control systems

Consumer electronics

IoT and new energy electronic products


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