BGA Assembly Capabilities

Overview

We specialize in high-precision BGA (Ball Grid Array) assembly services, with over 15 years of experience in fine-pitch BGA, micro BGA, CSP, and other array package assembly. Our assembly facility is equipped with high-precision placement machines, nitrogen reflow ovens, and high-resolution X-Ray inspection systems, to ensure reliable BGA assembly quality. All BGA assembly processes strictly follow IPC-A-610 international standards, with defect rate below 100 PPM for mass production orders. We support BGA assembly for prototype orders starting from 5 pieces, up to full-scale volume production.

BGA Package Type Capability

Standard plastic BGA (PBGA)

Ceramic BGA (CBGA)

Micro BGA (μBGA)

Chip Scale Package (CSP)

Fine-pitch BGA with minimum ball pitch 0.25mm

Ultra-fine pitch BGA down to 0.2mm ball pitch

Large BGA with maximum size 50mm × 50mm

BGA with up to 2000 I/O pins

Stacked BGA package

PoP (Package on Package) assembly

QFN, LGA, and other array packages

BGA Assembly Precision Capability

Minimum BGA ball pitch: 0.2mm

Maximum BGA size: 50mm × 50mm

Placement accuracy: ±0.015mm for BGA components

Placement rotation accuracy: ±0.05 degree

Reflow temperature control accuracy: ±1℃

X-Ray inspection resolution: 5μm

Void detection accuracy: down to 1% of ball size

Maximum board thickness for BGA assembly: 6.0mm

Minimum board thickness for BGA assembly: 0.4mm

BGA Assembly Process Capability

BGA design review and DFM optimization

BGA stencil design and fabrication with customized aperture design

Solder paste printing with automatic screen printer and 3D SPI inspection

High-precision BGA placement with vision alignment system

Nitrogen reflow soldering with customized temperature curve

100% X-Ray inspection for BGA solder joint quality

BGA reballing service for damaged or reused components

BGA rework service with professional BGA rework station

BGA reliability testing including thermal cycle and aging test

BGA Quality Control and Inspection Capability

Pre-assembly BGA component incoming inspection including ball coplanarity, dimension, and authenticity

Stencil design verification and first print inspection

First Article Inspection (FAI) after BGA placement

100% 3D Solder Paste Inspection (SPI) before placement

Real-time reflow temperature curve monitoring and recording

100% high-resolution X-Ray inspection for every BGA component

X-Ray inspection items: solder void, cold solder, solder bridge, missing ball, ball alignment, and solder wetting

Void acceptance standard: IPC Class 2 (void area <25% per ball) for standard applications; IPC Class 3 (void area <15% per ball) for high-reliability applications

Post-assembly electrical testing and functional testing

Microsection analysis for BGA solder joint quality verification (sample test)

BGA Design Support Capability

BGA footprint design review and optimization

Via in pad design support with resin filled via process

Via near pad design support with solder mask tented via

BGA escape routing design review

Impedance control design verification for BGA high-speed signals

Power distribution network (PDN) design review for BGA power supply

Thermal relief design review for BGA thermal pad

Solder mask and paste mask design optimization

Stencil aperture design recommendation for different BGA packages