Overview
With over 15 years of specialized experience in domestic PCB fabrication, we deliver high-reliability PCB solutions from rapid prototyping to full-scale volume production. Our manufacturing capabilities cover the full spectrum of PCB types for consumer electronics, industrial control, automotive, medical devices, and telecommunication applications. All production processes strictly follow IPC-A-600, IPC-6012 international standards, with ISO9001, IATF16949, UL, RoHS certifications. We maintain a 99.5% on-time delivery rate and 99.7% batch yield rate for all orders, with zero minimum order quantity limitations for standard specifications.
Base Material Capability
Standard FR-4 from Shengyi, Kingboard, and other well-known domestic and international suppliers
High TG FR-4 with TG value from 150℃ to 180℃
Halogen-free FR-4 compliant with global environmental regulations
High-frequency materials including Rogers, Arlon, Isola, Taconic
Metal base materials including aluminum base, copper base, iron base
Flexible materials including PI, PET for FPC and rigid-flex PCB
Ceramic substrates for high-temperature and high-frequency applications
Layer Count Specification
Single-sided PCB
Double-sided PCB
Multilayer PCB from 4 layers to 64 layers
HDI PCB with 1+N+1, 2+N+2, 3+N+3 stack-up structures
Rigid-flex PCB from 2 layers to 16 layers
Flexible PCB from 1 layer to 8 layers
Dimensional Capability
Maximum panel size for single-sided and double-sided PCB: 600mm × 1200mm
Maximum panel size for multilayer PCB: 560mm × 1150mm
Minimum panel size: 3mm × 3mm
Board thickness range: 0.2mm to 6.0mm
Board thickness tolerance: ±0.1mm for boards thinner than 1.0mm; ±10% for boards 1.0mm and above
Outline dimension tolerance: ±0.2mm for CNC routing; ±0.5mm for V-scoring
Trace and Via Capability
Minimum trace width and spacing: 2/2mil for inner layers; 2.5/2.5mil for outer layers
Minimum finished copper thickness: 1/3oz (12μm)
Maximum finished copper thickness: 8oz (280μm)
Minimum mechanical drill hole diameter: 0.15mm
Minimum laser drill hole diameter: 0.075mm
Maximum aspect ratio: 16:1 for through holes
Minimum annular ring: 0.1mm
Via types supported: through hole, blind via, buried via, via in pad, resin filled via
Surface Finish Capability
Organic Solderability Preservative (OSP)
Lead-free Hot Air Solder Leveling (HASL)
Leaded Hot Air Solder Leveling (HASL)
Electroless Nickel Immersion Gold (ENIG)
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Immersion Silver
Immersion Tin
Hard Gold Plating
Soft Gold Plating
Carbon Ink
Special Process Capability
Back drilling with minimum stub length 0.1mm
Countersink and counterbore holes
Castellated holes
V-scoring on single side and double sides
Step groove and step board structure
Impedance control with tolerance ±5% to ±10%
Mixed pressure structure with FR-4 and high-frequency materials
Edge plating
Plug holes with resin, solder mask, or conductive ink
