Overview
In-Circuit Testing (ICT) is a power-on electrical inspection process for assembled PCBA boards, executed after the SMT assembly process is completed. It uses professional fixture-based testing equipment to conduct a comprehensive electrical inspection of each node on the assembled board, to verify the correctness of component assembly and the electrical performance of the hardware circuit. This process can quickly and accurately locate component-level assembly defects, and is the core quality control gate to ensure that the hardware of the assembled board is fully consistent with the design BOM and schematic. All ICT operations strictly follow IPC-A-610 international standards.
Fixture-Based Testing Mechanism
Specialized test fixtures are customized according to the PCB design and test points, for each PCBA product
The fixture uses a needle bed structure to contact the test points on the PCBA, to realize the electrical connection with the test equipment
The test equipment applies a controllable test signal to the PCBA through the fixture, to collect the electrical response data of each node
The test system compares the collected data with the standard design parameters, to automatically identify defects
Test fixtures are verified and calibrated before use, to ensure the accuracy and stability of the test results
Component Assembly Verification
Missing component and wrong component defect inspection
Component value deviation inspection for resistors, capacitors, inductors and other passive components
Polarity reversal defect inspection for diodes, triodes, electrolytic capacitors and other polarized components
Pin short circuit and open circuit defect inspection for integrated circuit components
Solder bridge and cold solder defect inspection between component pins
Wrong BOM and wrong package component defect inspection
Electrical Performance Validation
Power supply circuit voltage output and ripple performance test
Clock circuit frequency and stability test
Analog circuit parameter accuracy test
Digital circuit logic level verification
Circuit insulation resistance and withstand voltage test
Protection circuit function verification
Power consumption test of the whole board
Defect Rapid Positioning Function
The test system can accurately locate the defective component and defect type, with specific coordinate information
Defect classification is automatically completed according to the risk level, to guide the rework process
Defect data is displayed in real time, with clear defect images and parameter comparison data
Batch defect trend is statistically analyzed, to identify continuous assembly process problems
Defect location and disposal records are automatically archived, with full traceability
Batch Testing Efficiency Optimization
The test process is fully automated, with a single board test time of only a few seconds
Batch test can be executed continuously, with automatic recording of test results for each board
Test programs can be optimized according to the product characteristics, to shorten the test time and improve efficiency
Unqualified boards are automatically marked and isolated, to avoid mixing with qualified products
Test data is synchronized to the production management system in real time, to monitor the assembly yield of the batch
